Etching a substrate: processes – Masking of a substrate using material resistant to an etchant
Reexamination Certificate
2008-03-04
2008-03-04
Alanko, Anita (Department: 1765)
Etching a substrate: processes
Masking of a substrate using material resistant to an etchant
C216S083000, C101S327000, C101S333000, C101S401100, C205S118000
Reexamination Certificate
active
07338613
ABSTRACT:
An automated process for microcontact printing is provided, comprising the steps of providing a substrate and a stamp; automatically aligning the substrate and stamp so that the stamp is aligned relative to the substrate to impart a pattern to the substrate at a desired location and with a desired orientation on the substrate; applying an ink to the stamp, the ink including a molecular species adapted to form a self-assembling monolayer (SAM) on the substrate; contacting the stamp and the substrate; and separating the stamp from the substrate.
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Kendale Amar
Schueller Olivier J. A.
Alanko Anita
Kenyon & Kenyon LLP
Surface Logix Inc.
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