Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2011-03-08
2011-03-08
Mariam, Daniel G (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C382S149000
Reexamination Certificate
active
07903864
ABSTRACT:
A method for the detection of an irregularity in an object based on an image of the object that includes the steps of binarizing the image at a plurality of binarization thresholds to obtain a plurality of binarized images, extracting information from each of the binarized images, estimating the regular object resulting from the binarization at the respective binarization threshold of an image of a version of the object in which the irregularity is absent, combining the information extracted from each of the binarized images, and detecting the irregularity based on the combined information. A method for the detection of a defect in a solder element based on an X-ray image of the solder element. This aspect includes the steps of binarizing the image at a plurality of binarization thresholds to obtain a plurality of binarized images, extracting information from each of the binarized images, combining the information extracted from each of the binarized images, and detecting the defect based on the combined information.
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Atsushi Teramoto, et al., Development of an Automated X-Ray Inspection Method for Microsolder Bumps; 2005 International Symposium on Electronic Materials and Packaging (EMAP2005), Dec. 11-14, 2005; pp. 21-26, Tokyo Institute of Technology, Tokyo, Japan.
Blais-Morin Louis-Antoine
Lina Arnaud
Rioux Yves
Foley & Lardner LLP
Mariam Daniel G
Matrox Electronic Systems Ltd.
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