Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-09-20
2005-09-20
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S678000, C257S777000, C257S778000
Reexamination Certificate
active
06946728
ABSTRACT:
This invention provides a system and method for hermetically sealing a post media-filled package with a metal cap. The method can include the operation of filling a MEMS package through a fill port with at least one medium. A further operation can be plugging the fill port in the MEMS package with a sealant. Another operation can include depositing a metal cap over the sealant to hermetically seal the fill port.
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Chen Chien-Hua
Haluzak Charles C.
Michael Donald
Nelms David
Nguyen Dao H.
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