System and methods for analyzing copper chemistry

Details System and methods for analyzing copper chemistry System and methods for analyzing copper chemistry

2006-04-04

2006-04-04

King, Roy (Department: 1742)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Involving measuring, analyzing, or testing

C205S775000, C205S788500, C205S789500, C356S300000

Reexamination Certificate

active

07022215

ABSTRACT:
The present invention relates to methods for removing the matrix effects caused by variance in copper concentration and acidity during measurement of the organic additive concentration in a sample copper plating solution.

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Freeman, J.E., et al., Analytica Chimica Acta, 1985, vol. 177, pp. 121-128, especially pp. 121-122.
Cerna, N., Determination of Chlorides in an Acid Copper-plating Bath, Abstract from Povrchove Uprary, 1973, vol. 13(6), pp. 11-12.
Skoog, D.A., Principles of Instrumental Analysis, 3rdEd., 1985, pp. 332-337, especially p. 336.
Cheng, et al., Analysis of organic additives in Copper-plating brighteneer by High Performance Liquid Chromatography, Abstract from Sepu, 1999, vol. 17(6), pp. 602-603.
H. W. Seisler, Y. Ozaki, S. Kawata, and H.M. Heise.Near Infrared SpectroscopyWiley-VCH Verlag GmbH, Weinham, Germany, 2002.

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