System and method to provide RF shielding for a MEMS...

Details System and method to provide RF shielding for a MEMS... System and method to provide RF shielding for a MEMS...

2011-03-29

2011-03-29

Mandala, Victor (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

With means to shield device contained in housing or package...

C257S659000, C257S728000, C257SE23114

Reexamination Certificate

active

07915715

ABSTRACT:
A semiconductor package has a substrate. An opening is formed through the substrate. A first RF shield is formed around a perimeter of the opening. A first die is attached to the first surface of the substrate and positioned over the opening.

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