System and method to increase die stand-off height

Details System and method to increase die stand-off height System and method to increase die stand-off height

2006-06-06

2009-10-06

Tran, Thien F (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Incorporating resilient component

C438S118000, C438S612000

Reexamination Certificate

active

07598124

ABSTRACT:
In accordance with the present invention, a system and method to increase die stand-off height in a flip chip are provided. The system includes a plurality of separator pedestals disposed between a first face of a die and a second face of a substrate, the substrate positioned generally parallel with, and spaced apart from, the die, and the first face being opposite the second face. The plurality of separator pedestals are operable to selectively force the die and substrate apart, increasing the stand-off height of the flip chip assembly.

REFERENCES:
patent: 5633535 (1997-05-01), Chao et al.
patent: 6649444 (2003-11-01), Earnworth et al.

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