System and method to analyze low yield of wafers caused by...

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

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C700S108000, C702S183000

Reexamination Certificate

active

07127317

ABSTRACT:
The present invention provides an Intelligent Engineering Data Analysis (I-EDA) system and method to help prevent low wafer yield and prevent occurrences of abnormal events. The I-EDA has a non-conforming wafer tracing (NCWT) system that operates to correlate occurrences of abnormal events with low wafer yield. The method generally has the steps of performing a fabrication operation on wafers disposed within a wafer lot; determining if an abnormal event occurred while performing the fabrication operation on the wafers disposed within the wafer lot; using a NCWT to determine a statistical correlation between an occurrence of an abnormal event and a wafer yield of the wafers being processed during the occurrence of the abnormal event if the abnormal event occurred during processing of the wafers disposed within the wafer lot; and using the determined statistical correlation to analyze the fabrication process and thereby improve wafer yield.

REFERENCES:
patent: 6324481 (2001-11-01), Atchison et al.
patent: 6684124 (2004-01-01), Schedel et al.
patent: 2002/0183879 (2002-12-01), Schedel et al.
patent: 2003/0158795 (2003-08-01), Markham et al.
patent: 2004/0029029 (2004-02-01), Atkinson et al.

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