System and method of transferring dies using an adhesive...

Details System and method of transferring dies using an adhesive... System and method of transferring dies using an adhesive...

2005-02-01

2005-02-01

Hong, John C. (Department: 3726)

Metal working

Method of mechanical manufacture

Assembling or joining

C029S428000, C029S729000, C029S743000, C029S709000

Reexamination Certificate

active

06848162

ABSTRACT:
A method and system for transferring a plurality of integrated circuit dies from a first surface to a second surface is described. The second surface is positioned to be closely adjacent to the first surface that has a plurality of dies attached thereto. A distance is reduced between the first surface and the second surface until the plurality of dies contact the second surface and attach to the second surface due to an adhesiveness of the second surface. The first surface and second surface are moved apart. The plurality of dies remain attached to the second surface.

REFERENCES:
patent: 4346514 (1982-08-01), Makizawa et al.
patent: 5966903 (1999-10-01), Dudderar et al.
patent: 6731353 (2004-05-01), Credelle et al.
patent: 20030136503 (2003-07-01), Green et al.
Copy of International Search Report for Application No. PCT/US03/23792, mailed Jan. 12, 2004 (4 pages).

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