Liquid purification or separation – Processes – Ion exchange or selective sorption
Reexamination Certificate
2005-08-02
2009-02-10
Barry, Chester T (Department: 1797)
Liquid purification or separation
Processes
Ion exchange or selective sorption
C210S688000, C210S748080, C210S757000
Reexamination Certificate
active
07488423
ABSTRACT:
Wastewater streams from semiconductor processing operations are treated to reduce the concentration therein of one or more metal species to a satisfactory level. The disclosed systems and technique utilize complexing ion exchange media to treat the wastewater streams having a significant concentration of oxidizing species.
REFERENCES:
patent: 2271482 (1942-01-01), Hoelkeskamp et al.
patent: 3301542 (1967-01-01), Medford, Jr. et al.
patent: 3428449 (1969-02-01), Swanson
patent: 3440036 (1969-04-01), Spinney
patent: 3658697 (1972-04-01), Huether
patent: 3870033 (1975-03-01), Faylor et al.
patent: 3873581 (1975-03-01), Fitzpatrick et al.
patent: 3912801 (1975-10-01), Stephens
patent: 3914374 (1975-10-01), Koehler et al.
patent: 3923741 (1975-12-01), Asano et al.
patent: 3928192 (1975-12-01), Katzakian, Jr. et al.
patent: 3941837 (1976-03-01), Asano et al.
patent: 3959129 (1976-05-01), White et al.
patent: 3985648 (1976-10-01), Casolo
patent: 4010099 (1977-03-01), Leach et al.
patent: 4070281 (1978-01-01), Tagashira et al.
patent: 4210530 (1980-07-01), Etzel et al.
patent: 4231888 (1980-11-01), Dalton
patent: 4303704 (1981-12-01), Courduvelis et al.
patent: 4329210 (1982-05-01), Merchant et al.
patent: 4569769 (1986-02-01), Walton et al.
patent: 4629570 (1986-12-01), Kennedy, Jr.
patent: 4666683 (1987-05-01), Brown et al.
patent: 5045213 (1991-09-01), Bowers
patent: 5149437 (1992-09-01), Wilkinson et al.
patent: 5225087 (1993-07-01), Kardos
patent: 5256187 (1993-10-01), Gefvert
patent: 5298168 (1994-03-01), Guess
patent: 5346627 (1994-09-01), Siefert et al.
patent: 5348588 (1994-09-01), Winston
patent: 5348712 (1994-09-01), Marquis et al.
patent: 5348724 (1994-09-01), Hagimori et al.
patent: 5437797 (1995-08-01), Helmig
patent: 5464605 (1995-11-01), Hayden
patent: 5476883 (1995-12-01), Abe et al.
patent: 5558775 (1996-09-01), Busch, Jr.
patent: 5599515 (1997-02-01), Misra et al.
patent: 5616790 (1997-04-01), Arnold et al.
patent: 6069209 (2000-05-01), Darling et al.
patent: 6106728 (2000-08-01), Lida et al.
patent: 6203705 (2001-03-01), James et al.
patent: 6306282 (2001-10-01), Dungan et al.
patent: 6315906 (2001-11-01), Sassaman, Jr. et al.
patent: 6346195 (2002-02-01), Filson et al.
patent: 6521131 (2003-02-01), Hamilton et al.
patent: 6747065 (2004-06-01), Paszkowski
patent: 6818129 (2004-11-01), Kemp et al.
patent: 6878285 (2005-04-01), Hughes
patent: 6896808 (2005-05-01), Jay
patent: 7048857 (2006-05-01), Jangbarwala
patent: 2001/0008828 (2001-07-01), Uchikura et al.
patent: 2002/0077035 (2002-06-01), Wang et al.
patent: 2002/0104803 (2002-08-01), Filson et al.
patent: 2003/0044335 (2003-03-01), Jangbarwala
patent: 0 761 603 (1997-03-01), None
patent: 55062794 (1980-05-01), None
patent: 06-121978 (1994-05-01), None
patent: 08-024897 (1996-01-01), None
patent: 08-039054 (1996-02-01), None
patent: 08-141579 (1996-06-01), None
patent: 09-117763 (1997-05-01), None
patent: 10-111387 (1998-04-01), None
patent: WO 97/29048 (1997-08-01), None
Walter F. Worth, “The ESH impact of advanced lithography materials and processes,”Semiconductor Fabtech-23rdEdition, Jul. 2004, pp. 37-42.
Michael W. Wismer et al., “Copper CMP treatment using the Copper Select™ process,”Semiconductor Fabtech-25thEdition, Feb. 2005, pp. 1-5.
P.h. Haumessera et al., “Copper metallization for advanced interconnects: the electrochemical revolution,”Semiconductor Fabtech-23rdEdition, Jul. 2004, pp. 85-89.
Dr. Liang Chen, “Breakthrough technology for CMP,”Semiconductor Fabtech-24thEdition, Oct. 2004, pp. 137-141.
Jay M. Dietrich, “Management of Copper CMP effluents,”Semiconductor Fabtech-24thEdition, Oct. 2004, pp. 51-55.
BIRM® Product Literature, Clack Corporation, Jun. 2003.
“Ion Exchange Resins for the Remediation of Groundwater,” Product Literature, Sybron Chemicals, Inc., publication date unknown.
Phil Fatula, “Technical Briefing—A Progress Report on the Direct Application of Imidodiacetic-functional IX Resins in Cu CMP Waste Treatment,”Ultrapure Water, vol. 22, No. 5, Jul./Aug. 2005, pp. 30-31.
F.X. McGarvey et al., “Removal and Recovery of Metals by Ion Exchange,” Sybron Chemicals, Inc.23rdAnnual Liberty Bell Corrosion Course 4, 1985, pp. 1-9.
John Weems, “Lessons Learned: The installation of a 300 to 600 GPM semiconductor high-purity water system,”Ultrapure Water, Sep. 1999, pp. 26-30.
Mary Reker et al., “Treatment and water recycling of copper CMP slurry waste streams to achieve environmental compliance for copper and suspended solids,”Semiconductor Fabtech-8thEdition, 15 pages, publication date unknown.
Day James C.
Wismer Michael W.
Woodling Richard
Barry Chester T
Siemens Water Technologies Holding Corp.
LandOfFree
System and method of slurry treatment does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System and method of slurry treatment, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method of slurry treatment will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4093961