Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Reexamination Certificate
2008-05-28
2009-12-15
Nguyen, Khanh (Department: 1791)
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
C264S272150, C264S272140
Reexamination Certificate
active
07632446
ABSTRACT:
Electrical components mounted onto a circuit board may be sealed within a frame tray upon the addition of a curable material that encapsulates the circuit board. The electrical components of the circuit board are positioned and sealed within the frame tray such that the cured material does not affect an airflow path which dissipates heat produced by the electrical components during use. The curing of the curable material shields the circuit board from moisture, dust and other environmental contaminates.
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Hahn Loeser & Parks LLP
Lincoln Global Inc.
Nguyen Khanh
Patel Vishal I
Smith Timothy D.
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