System and method of performing uniform dose implantation...

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C250S492200, C250S281000, C250S282000, C250S3960ML, C250S397000, C427S523000

Reexamination Certificate

active

08071964

ABSTRACT:
An ion implantation system and associated method includes a scanner configured to scan a pencil shaped ion beam into a ribbon shaped ion beam, and a beam bending element configured to receive the ribbon shaped ion beam having a first direction, and bend the ribbon shaped ion beam to travel in a second direction. The system further includes an end station positioned downstream of the beam bending element, wherein the end station is configured to receive the ribbon shaped ion beam traveling in the second direction, and secure a workpiece for implantation thereof. In addition, the system includes a beam current measurement system located at an exit opening of the beam bending element that is configured to measure a beam current of the ribbon shaped ion beam at the exit opening of the beam bending element.

REFERENCES:
patent: 4367411 (1983-01-01), Hanley et al.
patent: 4539217 (1985-09-01), Farley
patent: 4587433 (1986-05-01), Farley
patent: 4847504 (1989-07-01), Aitken
patent: 4851693 (1989-07-01), Fisher
patent: 5834786 (1998-11-01), White et al.
patent: 6323497 (2001-11-01), Walther
patent: 7589333 (2009-09-01), Graf et al.
patent: 2004/0047561 (2004-03-01), Tuda
patent: 2004/0149983 (2004-08-01), Lee et al.
patent: 2006/0057303 (2006-03-01), Agarwal et al.
patent: 2009/0218315 (2009-09-01), Shannon
patent: 2009/0272918 (2009-11-01), Satoh
U.S. Appl. No. 12/717,536, filed Mar. 4, 2010.
Notice of Allowance Dated Sep. 20, 2011 for U.S. Appl. No. 12/717,536. 22 Pages.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

System and method of performing uniform dose implantation... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method of performing uniform dose implantation..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method of performing uniform dose implantation... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4313612

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.