System and method of manufacture for interconnecting an...

Details System and method of manufacture for interconnecting an... System and method of manufacture for interconnecting an...

2007-04-09

2010-11-23

Fahmy, Wael M (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

C257S784000, C257S781000, C257S780000, C257S772000, C257SE21575, C257SE21597, C257SE21627, C257SE21641, C438S745000, C438S687000

Reexamination Certificate

active

07838999

ABSTRACT:
An integrated circuit/substrate interconnect apparatus and method of manufacture are provided. Included is a substrate with a plurality of wells and a landing pad formed in each of the wells. The substrate further includes a seed layer deposited in each of the wells over the landing pad, and a metalized layer deposited in each of the wells over the seed layer. Before assembly, an upper surface of the metalized layer forms a well.

REFERENCES:
patent: 6415974 (2002-07-01), Jao
patent: 6819000 (2004-11-01), Magerlein et al.
patent: 7239025 (2007-07-01), Farrar
patent: 2004/0159944 (2004-08-01), Datta et al.

Affiliated with

Also associated with

Rating

System and method of manufacture for interconnecting an... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method of manufacture for interconnecting an..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method of manufacture for interconnecting an... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4250383