System and method of heating up a semiconductor device in a...

Details System and method of heating up a semiconductor device in a... System and method of heating up a semiconductor device in a...

2006-08-01

2006-08-01

Nghiem, Michael (Department: 2863)

Data processing: measuring, calibrating, or testing

Testing system

Of circuit

C324S754120

Reexamination Certificate

active

07085667

ABSTRACT:
Methods of efficiently and accurately heating a semiconductor device in a standard (i.e. room temperature) handler are provided. In one embodiment, an infrared light source can be focused on the device to heat its chip. In another embodiment, the substrate diode in the device can be forward biased to heat the chip. Advantageously, the forward voltage of the substrate diode has a direct relationship with chip temperature. This relationship can be determined based on a characterization of an exemplary device type. Therefore, measuring the forward voltage can provide an accurate derivation of chip temperature. Heating of the device using a focused light source or substrate diode can be done immediately prior to testing, thereby providing an extremely time efficient way to test the device under high temperature conditions.

REFERENCES:
patent: 4412235 (1983-10-01), Bois
patent: 6066956 (2000-05-01), Nikawa
patent: 6559667 (2003-05-01), Tarter
patent: 2001/0049875 (2001-12-01), Watanabe et al.
patent: 2003/0228721 (2003-12-01), Efland et al.

Affiliated with

Also associated with

Rating

System and method of heating up a semiconductor device in a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method of heating up a semiconductor device in a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method of heating up a semiconductor device in a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3641501