System and method of coinsurance wafer management

Details System and method of coinsurance wafer management System and method of coinsurance wafer management

2006-04-18

2006-04-18

Picard, Leo (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S112000

Reexamination Certificate

active

07031795

ABSTRACT:
A system and method of coinsurance wafer management. The system includes at least one production line and an order management unit. The production line processes a MPW shuttle including original wafers and coinsurance wafers with a common fabrication process before metal layering, processes the original wafers with different metal layering fabrication processes according to a metal layering technology of each device design of the MPW shuttle, and withholds the coinsurance wafers without further fabrication. The order management unit receives a request for a designated device design before a cutoff date, and the production line releases and processes coinsurance wafers with the metal layering fabrication process corresponding to the designated device design when the request is received.

REFERENCES:
patent: 6584369 (2003-06-01), Patel et al.
patent: 6687563 (2004-02-01), Wang et al.
patent: 6716648 (2004-04-01), Iriki
patent: 6799311 (2004-09-01), Ryskoski
patent: 2001/0007795 (2001-07-01), Kawamura et al.
patent: 2002/0129901 (2002-09-01), Fujikawa et al.

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