System and method of automatically polishing semiconductor wafer

Details System and method of automatically polishing semiconductor wafer System and method of automatically polishing semiconductor wafer

1997-02-13

1998-08-11

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

Computer controlled

451 6, 451 41, 451 63, 451289, 451307, 451388, 451296, B24B 4912

Patent

active

057919690

ABSTRACT:
A method of automatically polishing a semiconductor wafer having a substrate and a surface film. A wafer mounting device, which may include a vacuum chuck, holds the semiconductor wafer without requiring that the wafer have a central aperture. The mounting device and wafer are moved with an orbit-within-an-orbit motion while a tape transport mechanism applies an abrasive polishing tape to the surface film of the moving wafer to polish one surface of the wafer to a flatness of less than two microns. The polishing tape passes arcuately around a roller and passes between the roller and the surface film and contacts the surface film in a line running across the width of the tape. The system determines the thickness of the wafer surface film during the polishing process with a real time measurement device such as an effipsometer, or by determining a work-performed factor and calculating an estimated film thickness from the work-performed factor. Finally, the system automatically controls the polishing process to stop polishing the semiconductor wafer when the wafer surface film achieves a predefined planarization.

REFERENCES:
patent: 4692223 (1987-09-01), Lampert et al.
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5569063 (1996-10-01), Morioka et al.
patent: 5643044 (1997-07-01), Lund
patent: 5643056 (1997-07-01), Hirose et al.
patent: 5645471 (1997-07-01), Strecker

Affiliated with

Also associated with

Rating

System and method of automatically polishing semiconductor wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method of automatically polishing semiconductor wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method of automatically polishing semiconductor wafer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-383223