System and method having evaporative cooling for memory

Details System and method having evaporative cooling for memory System and method having evaporative cooling for memory

2011-06-07

2011-06-07

Vortman, Anatoly (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679520, C361S679460, C361S709000, C361S711000, C257S719000

Reexamination Certificate

active

07957134

ABSTRACT:
A system, in one embodiment, may include an in-line memory module with a plurality of memory circuits disposed on a circuit board, wherein the circuit board may have an edge connector with a plurality of contact pads. The system also may include a heat spreader disposed along the plurality of memory circuits. Finally, the system may include a heat pipe, a vapor chamber, or a combination thereof, extending along the heat spreader. In another embodiment, a system may include a heat spreader configured to mount to an in-line memory module, and an evaporative cooling system at least substantially contained within dimensions of the heat spreader.

REFERENCES:
patent: 5109318 (1992-04-01), Funari et al.
patent: 5268812 (1993-12-01), Conte
patent: 5313097 (1994-05-01), Haj-Ali-Ahmadi et al.
patent: 5355942 (1994-10-01), Conte
patent: 5644161 (1997-07-01), Burns
patent: 5661339 (1997-08-01), Clayton
patent: 5708297 (1998-01-01), Clayton
patent: 5751553 (1998-05-01), Clayton
patent: 5892660 (1999-04-01), Farnworth et al.
patent: 5966287 (1999-10-01), Lofland et al.
patent: 6031727 (2000-02-01), Duesman et al.
patent: 6119765 (2000-09-01), Lee
patent: 6232659 (2001-05-01), Clayton
patent: 6233150 (2001-05-01), Lin et al.
patent: 6353538 (2002-03-01), Ali et al.
patent: 6362966 (2002-03-01), Ali et al.
patent: 6377460 (2002-04-01), Pohl et al.
patent: 6424528 (2002-07-01), Chao
patent: 6424532 (2002-07-01), Kawamura
patent: 6437437 (2002-08-01), Zuo et al.
patent: 6449156 (2002-09-01), Han et al.
patent: 6525420 (2003-02-01), Zuo et al.
patent: 6611057 (2003-08-01), Mikubo et al.
patent: 6760222 (2004-07-01), Wang
patent: 6765797 (2004-07-01), Summers et al.
patent: 6775139 (2004-08-01), Hsueh
patent: 6858929 (2005-02-01), Zuo et al.
patent: 6862185 (2005-03-01), Morris
patent: 6888719 (2005-05-01), Janzen et al.
patent: 6896039 (2005-05-01), Dussinger et al.
patent: 7005738 (2006-02-01), Zuo et al.
patent: 7007741 (2006-03-01), Sen et al.
patent: 7023700 (2006-04-01), Chiou et al.
patent: 7079396 (2006-07-01), Gates et al.
patent: 7100680 (2006-09-01), Dussinger et al.
patent: 7106595 (2006-09-01), Foster, Sr. et al.
patent: 7151668 (2006-12-01), Stathakis
patent: 7187552 (2007-03-01), Stewart et al.
patent: 7215551 (2007-05-01), Wang et al.
patent: 7345882 (2008-03-01), Lee et al.
patent: 7349219 (2008-03-01), Lai et al.
patent: 7382617 (2008-06-01), Yu et al.
patent: 7391613 (2008-06-01), Lai et al.
patent: 2003/0193788 (2003-10-01), Farnworth et al.
patent: 2004/0130873 (2004-07-01), Hsueh
patent: 2004/0250989 (2004-12-01), Im et al.
patent: 2005/0201063 (2005-09-01), Lee et al.
patent: 2005/0276021 (2005-12-01), Gates et al.
patent: 2007/0170580 (2007-07-01), Baek et al.
patent: 2007/0201208 (2007-08-01), Goodwin et al.
patent: 2007/0263359 (2007-11-01), Lai et al.
patent: 2008/0013282 (2008-01-01), Hoss et al.

Affiliated with

Also associated with

Rating

System and method having evaporative cooling for memory does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method having evaporative cooling for memory, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method having evaporative cooling for memory will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2626304