Data processing: structural design – modeling – simulation – and em – Simulating electronic device or electrical system
Reexamination Certificate
2003-09-30
2011-12-06
Shah, Kamini S (Department: 2128)
Data processing: structural design, modeling, simulation, and em
Simulating electronic device or electrical system
C703S007000, C700S121000, C438S005000
Reexamination Certificate
active
08073667
ABSTRACT:
A method, system and computer readable medium for controlling a process performed by a semiconductor processing tool includes inputting data relating to a process performed by the semiconductor processing tool, and inputting a first principles physical model relating to the semiconductor processing tool. First principles simulation is then performed using the input data and the physical model to provide a first principles simulation result, and the first principles simulation result is used to control the process performed by the semiconductor processing tool.
REFERENCES:
patent: 5377116 (1994-12-01), Wayne et al.
patent: 5526293 (1996-06-01), Mozumder et al.
patent: 5583780 (1996-12-01), Kee et al.
patent: 5629877 (1997-05-01), Tamegaya
patent: 5719796 (1998-02-01), Chen
patent: 5866437 (1999-02-01), Chen et al.
patent: 6185472 (2001-02-01), Onga et al.
patent: 6198980 (2001-03-01), Costanza
patent: 6304834 (2001-10-01), Enda
patent: 6467066 (2002-10-01), Kusunoki
patent: 6529789 (2003-03-01), Campbell et al.
patent: 6560503 (2003-05-01), Toprac et al.
patent: 6571371 (2003-05-01), Coss et al.
patent: 6587744 (2003-07-01), Stoddard et al.
patent: 6615097 (2003-09-01), Ozaki
patent: 6618856 (2003-09-01), Coburn et al.
patent: 6625497 (2003-09-01), Fairbairn et al.
patent: 6628809 (2003-09-01), Rowe et al.
patent: 6643616 (2003-11-01), Granik et al.
patent: 6728591 (2004-04-01), Hussey et al.
patent: 6757645 (2004-06-01), Chang et al.
patent: 6763277 (2004-07-01), Allen et al.
patent: 6774998 (2004-08-01), Wright et al.
patent: 6802045 (2004-10-01), Sonderman et al.
patent: 6810296 (2004-10-01), Bode et al.
patent: 6812045 (2004-11-01), Nikoonahad et al.
patent: 6905895 (2005-06-01), Coss et al.
patent: 7047095 (2006-05-01), Tomoyasu
patent: 7055112 (2006-05-01), Kuznicki et al.
patent: 7107571 (2006-09-01), Chang et al.
patent: 7184850 (2007-02-01), Logsdon et al.
patent: 7308395 (2007-12-01), Kaneko et al.
patent: 7333871 (2008-02-01), Schwarm
patent: 7356377 (2008-04-01), Schwarm
patent: 7622308 (2009-11-01), Hendler et al.
patent: 7958478 (2011-06-01), Saito et al.
patent: 2002/0032495 (2002-03-01), Ozaki
patent: 2002/0107604 (2002-08-01), Riley et al.
patent: 2002/0173941 (2002-11-01), Hines et al.
patent: 2002/0180449 (2002-12-01), Ushiku et al.
patent: 2003/0078738 (2003-04-01), Wouters et al.
patent: 2003/0101251 (2003-05-01), Low
patent: 2003/0135302 (2003-07-01), Hung et al.
patent: 2004/0044513 (2004-03-01), Kitahara
patent: 2004/0078319 (2004-04-01), Madhavan et al.
patent: 2004/0102934 (2004-05-01), Chang
patent: 2005/0010319 (2005-01-01), Patel et al.
patent: 2005/0010598 (2005-01-01), Shankar
patent: 2005/0016947 (2005-01-01), Fatke et al.
patent: 2005/0071034 (2005-03-01), Mitrovic
patent: 2005/0071035 (2005-03-01), Strang
patent: 2005/0071036 (2005-03-01), Mitrovic
patent: 2005/0071037 (2005-03-01), Strang
patent: 2005/0071038 (2005-03-01), Strang
patent: 2005/0071039 (2005-03-01), Mitrovic
patent: 2007/0042512 (2007-02-01), Kawabata
patent: 2010/0077372 (2010-03-01), Xiang et al.
patent: 2010/0100223 (2010-04-01), Hendler et al.
patent: 1335558 (2002-02-01), None
patent: 0 718 595 (1996-06-01), None
patent: 11-176906 (1999-07-01), None
patent: 2000-517473 (2000-12-01), None
patent: 2002-367875 (2002-12-01), None
patent: 2003-17471 (2003-01-01), None
patent: 2003-502771 (2003-01-01), None
patent: 2004-524685 (2004-08-01), None
patent: 2004-527117 (2004-09-01), None
patent: 2004-531878 (2004-10-01), None
patent: 2005-514790 (2005-05-01), None
patent: 2005-515623 (2005-05-01), None
patent: 2005-522018 (2005-07-01), None
patent: 1999-071784 (1999-04-01), None
patent: WO 97/21244 (1997-06-01), None
patent: WO 02/07210 (2002-01-01), None
patent: WO 02/065511 (2002-08-01), None
patent: WO 02/069063 (2002-09-01), None
patent: WO 02/077589 (2002-10-01), None
patent: WO 03/009345 (2003-01-01), None
patent: WO 03/058699 (2003-07-01), None
patent: WO 03/060779 (2003-07-01), None
“Heat Analysis on Insulated Metal Substrates”; Naomi Yonemura et al; IEEE 1996.
“Heat Analysis on Insulated Metal Substrates”; Naomi Yonemura et al; IEEE 1996—Provided earlier.
“Mathematic-Physical Engine: Parallel Processing for Modeling and Simulation of Physical Phenomena”; V.K.Jain et al; IEEE 1994—Copy provided earlier by applicant.
Su-shing Chen, “AEMPES: An expert system for in-situ diagnostics and process monitoring” addressing the on-tool simulation; IEEE 1990 paper, pp. 119-122.
“Modeling and Simulation,”.TheInternational Technology Roadmap for Semiconductors, 2001 Edition.
Jain, V., K. et al, Mathematical-Physics Engines: Parallel Processing for Modeling and Simulation of Physical Phenomena, 1994, IEEE, pp. 366-373.
1999 Casting Simulation Software Survey, Tony C. Midea, et al., Oct. 17, 2005, pp. 1-4.
Heru Setyawan, et al. “Visualization and numerical simulation of fine particle transport in a low-pressure parallel plate chemical vapor deposition reactor”, Chemical Engineering Science 57 (2002) pp. 497-506.
Agam Shah, “Tilera Targets Intel, AMD With 100-Core Processor”, PCWorld Solved, IDG News Oct. 26, 2009, pp. 1-3.
Robert W. Atherton, et al., “Detailed Simulation for Semiconductor Manufacturing”, Proceedings of the 1990 Winter Simulation Conference, pp. 659-663.
Angus J. MacDonald, et al. “Integrating Cam and Process Simulation to Enhance On-Line Analysis and Control of IC Fabrication”, IEEE Transactions on Semiconductor Conductor Manufacturing, vol. 3. No. 2, May 1990, pp. 72-79.
Paul P. Castrucci, et al. “Emerging Paradigms in Semiconductor Manufacturing”, 1990 International Semiconductor Manufacturing Science Symposium, pp. 21-23.
Yea-Huey Su, et al, “A Conceptual Framework for Manufacturng Service Provisioning by Virtual Fabs”, 1998 Semiconductor Manufacturing Technology Workshop, pp. 75-85.
Chanettre Rasmidatta, et al. “New Approaches for Simulation of Wafer Fabrication: The Use of Control Variates and Calibration Metrics”, Proceedings of the 2002 Winter Simulation Conference, pp. 1414-1422.
Office Action issued Mar. 30, 2011 in Japanese Patent Application No. 10-2006-7006632, (with English-language Translation), pp. 1-18, Acknowledged.
Office Action issued Jun. 19, 2009 in The People's Republic of China Patent Application No. 200480028517.6, (with English-language Translation), pp. 1-39, Acknowledged.
Mitrovic Andrej
Strang Eric J.
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Saxena Akash
Shah Kamini S
Tokyo Electron Limited
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