Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Reexamination Certificate
1999-09-17
2001-09-18
Osele, Mark A. (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
C156S583200, C438S464000, C438S976000
Reexamination Certificate
active
06290805
ABSTRACT:
FIELD OF THE INVENTION
The present invention generally relates to fabrication of semiconductor work pieces. More particularly, the present invention relates to a system and method for using a pick and place apparatus to move a fragile semiconductor work piece from a substrate.
BACKGROUND OF THE INVENTION
The manufacture of semiconductor and other electronic devices, hereinafter described as work pieces, generally includes steps such as sawing, scribing, breaking, sorting, inspecting, bonding, shipping, storage and additional processing. A number of tools and methods arc employed to handle the delicate work pieces throughout such manufacturing processes.
One such method involves the use of a film that contains a pressure sensitive adhesive mounted in a vacuum frame. In this method, the work pieces are individually secured to the adhesive film by the force of the adhesive. The film securing the work pieces is secured to the frame through the application of negative pressure applied through vacuum holes. This arrangement has proven efficient and effective in handling work pieces throughout a variety of fabrication processes. Once processing is completed, however, significant problems exist in removing the fragile work pieces from the adhesive film.
One method for removing work pieces from the adhesive film involves moving the film over a rotatable roller such that the work piece rides up on the roller. A pick and place apparatus utilizing a vacuum has a bar which is aligned with a longitudinal axis of the work piece. A vacuum source exerts a force normal to the film through a channel opening in the bar, pulling the work piece from the film. This method has demonstrated a successful, i.e., undamaged, removal yield well in excess of ninety-nine percent for work pieces with dimensions no larger than 12 mils by 320 mils.
Greater functionality is being integrated into semiconductor work pieces, thus causing the need for work pieces of greater dimensions. The above-described method is less effective, resulting in a lowered removal yield, for these larger work pieces. The increased width of the larger work pieces allows the work pieces to tilt relative to the pick and place apparatus, preventing the apparatus from forming a sufficient vacuum seal on the work piece when the vacuum bar is aligned with the longitudinal axis of the work piece.
Increasing the downward force of the pick and place apparatus may cause damage to the work piece, thus lowering the removal yield. Alternatively, a pick and place apparatus may be fabricated with various size vacuum bars to handle the different size semiconductor work pieces. However, fabricating different size pick and place apparatuses would add cost to the semiconductor fabrication process, and would add downtime to the process necessary to swap out or exchange pick and place apparatuses. Thus, there exists a need for an improved method of removing semiconductor work pieces having larger dimensions.
SUMMARY OF THE INVENTION
The present invention provides a method of using a pick and place device having a collet bar with elongated sides and a channel in communication with a vacuum source. The method includes positioning the collet bar over a work piece having a longitudinal axis and a width, angling the elongated sides of the collet bar relative to the longitudinal axis of the work piece, and exerting an upwardly directed vacuum force on the work piece.
The present invention also provides a system for picking up and removing a work piece from a first position. The system includes a collet bar having opposed elongated sides and a channel. The work piece has a longitudinal axis, and the collet bar elongated sides are at a first angle from the longitudinal axis.
These and other features and advantages of the invention will be more clearly understood from the following detailed description of the invention which is provided in connection with the accompanying drawings.
REFERENCES:
patent: 4990051 (1991-02-01), Safabakhsh et al.
patent: 6017804 (2000-01-01), Freund et al.
patent: 6123800 (2000-09-01), Freund et al.
patent: 6165310 (2000-12-01), Freund et al.
Freund Joseph Michael
Przybylek George John
Romero Dennis Mark
Agere Systems Optoelectronics Guardian Corp.
Dickstein , Shapiro, Morin & Oshinsky, LLP
Osele Mark A.
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