System and method for thermally manipulating a combination of a

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156 74, 156222, 1562733, 1562735, 1562755, 1562757, 156282, 156497, 156498, 369286, G11B 726, B29D 1700

Patent

active

061030392

ABSTRACT:
A system and method cures a combination of a top and a bottom substrate with a resin disposed in-between. A cure device inherently warps the combination in one direction as a result of a curing operation that the cure device performs on the combination. A temperature gradient inducing device is disposed closer to one of the top and bottom substrates to create a temperature gradient between the top and bottom substrate and thereby warp the combination in a direction opposite to the one direction.

REFERENCES:
patent: 3946367 (1976-03-01), Wohlmut
patent: 4219704 (1980-08-01), Russell
patent: 4385372 (1983-05-01), Drexler
patent: 4450553 (1984-05-01), Holster
patent: 4493887 (1985-01-01), Peeters et al.
patent: 4735878 (1988-04-01), Hamersley et al.
patent: 4905215 (1990-02-01), Hattori et al.
patent: 5009818 (1991-04-01), Arai et al.
patent: 5093174 (1992-03-01), Suzuki et al.
patent: 5126996 (1992-06-01), Iida et al.
patent: 5171392 (1992-12-01), Iida et al.
patent: 5202875 (1993-04-01), Rosen et al.
patent: 5238772 (1993-08-01), Yashiro et al.
patent: 5255262 (1993-10-01), Best et al.
patent: 5303224 (1994-04-01), Chikuma et al.
patent: 5303225 (1994-04-01), Satoh et al.
patent: 5540996 (1996-07-01), Hintz
patent: 5676809 (1997-10-01), Billman
patent: 5709785 (1998-01-01), LaBlanc, III et al.
patent: 5779855 (1998-07-01), Amo et al.
patent: 5900098 (1999-05-01), Mueller et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

System and method for thermally manipulating a combination of a does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method for thermally manipulating a combination of a , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for thermally manipulating a combination of a will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2002608

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.