System and method for the probing of a wafer

Details System and method for the probing of a wafer System and method for the probing of a wafer

2006-12-12

2006-12-12

Patel, Paresh (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S764010, C324S754090

Reexamination Certificate

active

07148716

ABSTRACT:
According to one embodiment of the invention, a method for resuming the probing of a wafer includes identifying a data set associated with a wafer. The data set identifies at least one unprobed die supported on the surface of the wafer. The method also includes determining that the data set associated with the wafer is useable and generating a probe map of the wafer from the data set. The probe map identifies a physical position associated with each unprobed die supported on the surface of the wafer. The probe map and one or more probe commands are communicated to a probe module to drive the probe module in resuming the probe of the wafer.

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patent: 2003/0094965 (2003-05-01), Tseng

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