System and method for the probing of a wafer

Details System and method for the probing of a wafer System and method for the probing of a wafer

2006-06-27

2006-06-27

Nguyen, Vinh (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

07068056

ABSTRACT:
In one embodiment, a method for probing a wafer includes providing a plurality of pressure sensors on a surface of a probe card holding tray, positioning a probe card of a testhead relative to a prober supporting a wafer, engaging the probe card with the probe card holding tray, receiving a plurality of pressure signals from respective pressure sensors, and comparing the pressure signals to determine if the probe card is substantially parallel with the prober.

REFERENCES:
patent: 5410259 (1995-04-01), Fujihara et al.
patent: 5604446 (1997-02-01), Sano
patent: 6469537 (2002-10-01), Akram et al.
patent: 6762612 (2004-07-01), Yu et al.
patent: 6774651 (2004-08-01), Hembree
patent: 6784678 (2004-08-01), Pietzschmann
patent: 2005/0116729 (2005-06-01), Koester et al.

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