System and method for the identification of chemical...

Details System and method for the identification of chemical... System and method for the identification of chemical...

2008-05-27

2008-05-27

Kwok, Helen (Department: 2856)

Measuring and testing

Vibration

By mechanical waves

C073S602000

Reexamination Certificate

active

11554716

ABSTRACT:
The present invention presents a novel application of a wavelet-based multiscale method in a nanomachining process chemical mechanical planarization (CMP) of wafer fabrication. The invention involves identification of delamination defects of low-k dielectric layers by analyzing the nonstationary acoustic emission (AE) signal collected during copper damascene (Cu-low k) CMP processes. An offline strategy and a moving window-based strategy for online implementation of the wavelet monitoring approach are developed.

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