Measuring and testing – Vibration – By mechanical waves
Reexamination Certificate
2008-05-27
2008-05-27
Kwok, Helen (Department: 2856)
Measuring and testing
Vibration
By mechanical waves
C073S602000
Reexamination Certificate
active
07377170
ABSTRACT:
The present invention presents a novel application of a wavelet-based multiscale method in a nanomachining process chemical mechanical planarization (CMP) of wafer fabrication. The invention involves identification of delamination defects of low-k dielectric layers by analyzing the nonstationary acoustic emission (AE) signal collected during copper damascene (Cu-low k) CMP processes. An offline strategy and a moving window-based strategy for online implementation of the wavelet monitoring approach are developed.
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Das Tapas K.
Ganesan Rajesh
Kumar Ashok
Sikder Arun K.
Kwok Helen
Sauter Molly L.
Smith & Hopen , P.A.
University of South Florida
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