System and method for testing ball grid arrays

Details System and method for testing ball grid arrays System and method for testing ball grid arrays

2006-03-07

2006-03-07

Nguyen, Vinh P. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S765010, C324S762010

Reexamination Certificate

active

07009413

ABSTRACT:
An apparatus for testing ball grid arrays (“BGAs”) is provided. The apparatus includes, a socket slot in a printed circuit board for holding a socket used for testing the BGAs; and plural holding members that support BGA solder balls. The socket top may have plural prong like holding members; plural circular holding members; and/or plural spiral holding members for supporting the solder balls. The holding members may be etched on a BGA socket top and are flexible, rigid and/or semi-rigid to provide support for the solder balls.

REFERENCES:
patent: 6246249 (2001-06-01), Fukasawa et al.
patent: 6249135 (2001-06-01), Maruyama et al.
patent: 6373267 (2002-04-01), Hiroi
patent: 6517362 (2003-02-01), Hirai et al.

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