Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-03-15
2011-03-15
Chervinsky, Boris L (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S701000, C165S104330, C062S259200
Reexamination Certificate
active
07907406
ABSTRACT:
System and method are provided for cooling an electronics rack. A modular cooling unit (MCU) is associated with the rack to provide system coolant to an electronics subsystem and a bulk power assembly. The MCU includes a liquid-to-liquid heat exchanger, and defines portions of facility and system coolant loops. Chilled coolant from a facility source is passed through the liquid-to-liquid heat exchanger to cool system coolant flowing through the system coolant loop. The system also includes an air-to-liquid heat exchanger in fluid communication with the system coolant loop, a pump in fluid communication with the system coolant loop, and a controller. The controller controls operation of the pump to adjust flow of system coolant through the system coolant loop dependent upon a mode of operation. In a standby mode, system coolant flows through the air-to-liquid heat exchanger at a lower flow rate, and expels heat to ambient air.
REFERENCES:
patent: 3754596 (1973-08-01), Ward, Jr.
patent: 4590538 (1986-05-01), Cray, Jr.
patent: 5198962 (1993-03-01), Tyson
patent: 6182742 (2001-02-01), Takahashi et al.
patent: 6349391 (2002-02-01), Petivan et al.
patent: 6374627 (2002-04-01), Schumacher et al.
patent: 6494050 (2002-12-01), Spinazzola et al.
patent: 6587343 (2003-07-01), Novotny et al.
patent: 6763880 (2004-07-01), Shih
patent: 6854284 (2005-02-01), Bash et al.
patent: 6854287 (2005-02-01), Patel et al.
patent: 6867970 (2005-03-01), Muller et al.
patent: 6927980 (2005-08-01), Fukuda et al.
patent: 7000467 (2006-02-01), Chu et al.
patent: 7002799 (2006-02-01), Malone et al.
patent: 7011143 (2006-03-01), Corrado et al.
patent: 7088585 (2006-08-01), Chu et al.
patent: 7106590 (2006-09-01), Chu et al.
patent: 7110260 (2006-09-01), Weber et al.
patent: 7236363 (2007-06-01), Belady
patent: 7254957 (2007-08-01), Weber et al.
patent: 7315448 (2008-01-01), Bash et al.
patent: 7400505 (2008-07-01), Campbell et al.
patent: 7641101 (2010-01-01), Campbell et al.
patent: 7757506 (2010-07-01), Ellsworth et al.
patent: 2004/0008483 (2004-01-01), Cheon
patent: 2004/0221604 (2004-11-01), Ota et al.
patent: 2005/0061541 (2005-03-01), Belady
patent: 2006/0002086 (2006-01-01), Teneketges et al.
patent: 2007/0101334 (2007-05-01), Atyam et al.
patent: 2007/0119569 (2007-05-01), Campbell et al.
patent: 2007/0227710 (2007-10-01), Belady et al.
patent: 2009/0086428 (2009-04-01), Campbell et al.
patent: 2009/0086432 (2009-04-01), Campbell et al.
patent: 2009/0126909 (2009-05-01), Ellsworth, Jr. et al.
patent: 2009/0126910 (2009-05-01), Campbell et al.
patent: 2010/0067193 (2010-03-01), Arimilli et al.
patent: 2010/0263855 (2010-10-01), Arimilli et al.
patent: 19845821 (2000-04-01), None
Morogan, “IBM Hints at Triple Redundancy in Power6”, (http://www.itjungle.com/breaking/bn032906-story-1.html) (Mar. 29, 2006).
Arent, “Liquid Coolant Distribution Unit with Convertible Air or Water Cooling”, IBM Technical Disclosure Bulletin, IP Prior Art Database, IP.com No. IPCOM000044828D (Feb. 6, 2005).
Nelson et al., “Thermal Performance of an Integral Immersion Cooled Multi-Chip Module Package”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, vol. 17, No. 3 (Sep. 1994).
D. Delia et al., “System Cooling Design for the Water-Cooled IBM Enterprise System/900 Processors”, IBM Journal of Research and Development, vol. 36, No. 4, pp. 791-803 (Jul. 1992).
Campbell Levi A.
Chu Richard C.
Ellsworth, Jr. Michael J.
Iyengar Madhusudan K.
Simons Robert E.
Chervinsky Boris L
Dennis Jung, Esq.
Heslin Rothenberg Farley & & Mesiti P.C.
International Business Machines - Corporation
Kevin P. Radigan, Esq.
LandOfFree
System and method for standby mode cooling of a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System and method for standby mode cooling of a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for standby mode cooling of a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2757811