Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2007-10-04
2008-12-23
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C385S052000, C257S680000
Reexamination Certificate
active
07468286
ABSTRACT:
A system and method for holding optoelectronic packages may be used to secure one or more optoelectronic packages for mounting one or more components at a mounting angle (i.e., an intermediate angle between 0° and 90°). The system may include one or more fixtures configured to pivot from a non-angled position to a single fixed angled position. According to exemplary embodiments, fixtures may be configured to secure a TO can type package while one or more components, such as photodetectors, are mounted to the TO can type package, for example, by bonding. The TO can type package may be a TO can laser package including a monitor photodetector or a TO can photodetector package. Of course, many alternatives, variations and modifications are possible without departing from this embodiment.
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Chen Chian-Hung
Chen Li-min
Lin Kai-Sheng
Applied Optoelectronics, Inc.
Coleman W. David
Grossman Tucker Perreault & Pfleger PLLC
Kinsella N. Stephan
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