System and method for seaming high-modulus, high-tenacity,...

Details System and method for seaming high-modulus, high-tenacity,... System and method for seaming high-modulus, high-tenacity,...

2011-06-07

2011-06-07

Sells, James (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

C156S581000

Reexamination Certificate

active

07954536

ABSTRACT:
A seaming system for forming a seam is disclosed, wherein the seam consists of at least two opposed sections of high-modulus, high-tenacity, low-elongation fabric sections joined by a tape. The system comprises a seamer head, and a seamer base that includes a topography configured to impart a predetermined pressure gradient to the adhesive layer, tape, and fabric sections of the seam. The resultant seam has a cross-section or thickness profile that generally corresponds to that of the applied pressure gradient. As such, the constructed seam more efficiently distributes stress imparted from any applied load.

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patent: 6979479 (2005-12-01), Lavan et al.
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Office Action mailed Aug. 13, 2009 in corresponding U.S. Appl. No. 11/391,747.
Office Action mailed Dec. 1, 2009 in corresponding U.S. Appl. No. 11/391,747.
Response as filed Nov. 13, 2009 in corresponding U.S. Appl. No. 11/391,747.
Response as filed Jan. 26, 2010 in corresponding U.S. Appl. No. 11/391,747.

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