Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-02-07
2010-06-15
Thai, Luan C (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S109000, C438S125000, C438S406000, C257S704000, C257S659000, C257S723000, C257SE23001
Reexamination Certificate
active
07736946
ABSTRACT:
A method for assembling a hermetically sealed package to contain a MEMS die and the hermetically sealed package are presented. The method includes selectively applying a glass mixture to a dome. The dome is heated to a first temperature sufficient to flow the glass mixture. The dome is pressed into contact with a carrier containing the MEMS device, the pressing being maintained at a pressure and for a temporal interval sufficient to flow the glass mixture onto the carrier. The dome is cooled while maintaining contact with the carrier, to a second temperature sufficient to allow the glass mixture to harden into a glass frit thereby to seal the carrier to the dome. The glass frit has a seal width.
REFERENCES:
patent: 6537892 (2003-03-01), Jordan et al.
patent: 6929974 (2005-08-01), Ding et al.
patent: 6939778 (2005-09-01), Harpster et al.
Curtis Harlan L.
DCamp Jon B.
Seppala Bryan R.
Spielberger Richard K.
Fogg & Powers LLC
Honeywell International , Inc.
Thai Luan C
LandOfFree
System and method for sealing a MEMS device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System and method for sealing a MEMS device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for sealing a MEMS device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4188988