Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2001-03-26
2004-12-14
Mayes, Melvin C. (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S387000, C156S510000, C156SDIG003
Reexamination Certificate
active
06830645
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a system and method for rupturing an encapsulated adhesive in a sheet media, such as an adhesive in a roll product. The system can further optionally include a printer for placing indicia on the sheet, a feeder for feeding the sheet, a cutter for cutting the roll product into discrete sheets and a label applicator for applying the discrete sheet to a desired product. This system can utilize a fixed, inclined activation blade which extends across the sheet media to rupture and/or spread the encapsulated media. Alternatively, a single crushing roller, a pair of crushing rollers or a series of crushing rollers can be used to rupture the encapsulated media. This roller or rollers can be used with or without the activation blade and can be eccentrically rotatable discs.
2. Description of the Background Art
Currently, it is known to place encapsulated adhesives on a sheet media. For example, a sheet of paper can have microdots or microlines with an adhesive as disclosed in U.S. Pat. No. 4,961,811. When it is desired to expose this adhesive, the encapsulated adhesive can be ruptured by applying pressure such as from a coin or fingernail. Other encapsulated adhesives are known which can be ruptured by exposure to heat.
However, there exists a need in the art for a system and method for rupturing an adhesive in a sheet media, which can work on a large scale. In other words, a system and method for mass producing a series of sheets which have their encapsulated adhesives ruptured are needed. Such a system and method can be used to supply ready to adhere labels for products. Other uses are also contemplated. Such a system and method should be reliable and of low costs and low need for maintenance.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the invention to provide a system which can reliably rupture encapsulated adhesives contained in a sheet media.
A further object of the invention is to provide a method for reliably rupturing encapsulated adhesives contained in a sheet media.
It is a further object of the invention to provide such a system and method which can be used on a large scale to quickly provide application-ready labels and other adherable products.
Yet another object of this invention is to provide a low cost and low maintenance system and method.
These and other objects of the present invention are fulfilled by a system for rupturing an encapsulated adhesive contained in sheet media, comprising a feeder for the sheet media and an activation device for releasing the encapsulated adhesive as the sheet media is moved past the device by the feeder.
Additionally, these and other objects are fulfilled by a method for rupturing an encapsulated adhesive contained in sheet media, comprising the steps of providing a sheet media, feeding the sheet media along a travel path, passing the sheet media against an activation device, and rupturing the encapsulated adhesive as the sheet media moves past the activation device.
Further scope of the applicability of the present invention will become apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.
REFERENCES:
patent: 2907682 (1959-10-01), Eichel
patent: 3489271 (1970-01-01), Tissot
patent: 3663269 (1972-05-01), Fischer et al.
patent: 3666597 (1972-05-01), Parnell
patent: 3725501 (1973-04-01), Hilbelink et al.
patent: 3728210 (1973-04-01), Piron
patent: 3924728 (1975-12-01), Brown et al.
patent: 3996308 (1976-12-01), Douek et al.
patent: 4080238 (1978-03-01), Wolinkski et al.
patent: 4354894 (1982-10-01), Lewis et al.
patent: 4544431 (1985-10-01), King
patent: 4707211 (1987-11-01), Shibata
patent: 4749432 (1988-06-01), Ando et al.
patent: 4784714 (1988-11-01), Shibata
patent: 4808639 (1989-02-01), Chernack
patent: 4961811 (1990-10-01), Haugwitz
patent: 4980410 (1990-12-01), Fryd et al.
patent: 5008133 (1991-04-01), Herbet et al.
patent: 5178717 (1993-01-01), Rodriguez
patent: 5277736 (1994-01-01), Logan
patent: 5443680 (1995-08-01), Gerber
patent: 5518576 (1996-05-01), Mendelovich et al.
patent: 5674345 (1997-10-01), Nash
patent: 5688363 (1997-11-01), Hinton et al.
patent: 5827913 (1998-10-01), Baetzold et al.
patent: 5895552 (1999-04-01), Matsuguchi
patent: 5897722 (1999-04-01), Bright
patent: 5942330 (1999-08-01), Kelley
patent: 5985441 (1999-11-01), Szczepaniec et al.
patent: 6206071 (2001-03-01), Majkrzak et al.
patent: 2002/0148556 (2002-10-01), Kawada
patent: 0 171 919 (1986-02-01), None
patent: 0 547 379 (1993-06-01), None
patent: 6-314062 (1994-11-01), None
“Capsules Capture New Markets,” Chemical Week, Dec. 21, 1963.
Hartley, “Versatile Capsules: New Packaging Conept of Microencapsulation Wins Many Converts,” The Wall Street Journal, Sep. 15, 1965.
Herbig, “Microencapsulation,” Encyclopedia of Chemical Technology, vol. 13, Second Edition, 1967, pp. 436-456.
Huber et al., “Capsular Adhesives,” Journal of the Technical Association of the Pulp and Paper Industry, vol. 49, No. 5, May 1966.
“NCR and Encapsulation,” Applications Research Department, The National Cash Register Company, Dayton Ohio.
Schwantes Todd Arlin
Wells Jeffrey Leigh
Wilhelms Steven Michael
Appleton Papers Inc.
Mayes Melvin C.
LandOfFree
System and method for rupturing encapsulated adhesive in... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System and method for rupturing encapsulated adhesive in..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for rupturing encapsulated adhesive in... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3313987