System and method for resumed probing of a wafer

Details System and method for resumed probing of a wafer System and method for resumed probing of a wafer

2008-01-29

2008-01-29

Patel, Paresh (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S754090, C324S764010

Reexamination Certificate

active

11551097

ABSTRACT:
According to one embodiment of the invention, a method for resuming the probing of a wafer includes identifying a data set associated with a wafer. The data set identifies at least one unprobed die supported on the surface of the wafer. The method also includes determining that the data set associated with the wafer is useable and generating a probe map of the wafer from the data set. The probe map identifies a physical position associated with each unprobed die supported on the surface of the wafer. The probe map and one or more probe commands are communicated to a probe module to drive the probe module in resuming the probe of the wafer.

REFERENCES:
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patent: 6166552 (2000-12-01), O'Connell
patent: 6262586 (2001-07-01), Furasawa
patent: 6477685 (2002-11-01), Lovelace

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