Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2008-01-29
2008-01-29
Patel, Paresh (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S754090, C324S764010
Reexamination Certificate
active
07323899
ABSTRACT:
According to one embodiment of the invention, a method for resuming the probing of a wafer includes identifying a data set associated with a wafer. The data set identifies at least one unprobed die supported on the surface of the wafer. The method also includes determining that the data set associated with the wafer is useable and generating a probe map of the wafer from the data set. The probe map identifies a physical position associated with each unprobed die supported on the surface of the wafer. The probe map and one or more probe commands are communicated to a probe module to drive the probe module in resuming the probe of the wafer.
REFERENCES:
patent: 4500836 (1985-02-01), Staudacher
patent: 5550480 (1996-08-01), Nelson et al.
patent: 5892686 (1999-04-01), Iijima
patent: 5917332 (1999-06-01), Chen et al.
patent: 5943551 (1999-08-01), Schemmel et al.
patent: 6140828 (2000-10-01), Iino et al.
patent: 6166552 (2000-12-01), O'Connell
patent: 6262586 (2001-07-01), Furasawa
patent: 6477685 (2002-11-01), Lovelace
Miller Curtis E
Rousey James E
Schuette Glenn E
Brady III Wade James
Patel Paresh
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Tung Yingsheng
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