Metal fusion bonding – Process – Repairing – restoring – or renewing product for reuse
Reexamination Certificate
2002-02-01
2004-12-14
Stoner, Kiley (Department: 1725)
Metal fusion bonding
Process
Repairing, restoring, or renewing product for reuse
C219S121640, C174S254000, C439S044000
Reexamination Certificate
active
06830176
ABSTRACT:
TECHNICAL FIELD
The present invention is related to flexible circuits and to systems and methods for repairing the flexible circuits.
BACKGROUND OF THE INVENTION
Flexible circuits are typically constructed of a polyester substrate and having conductive traces and electronic devices mounted thereon. While these flexible circuits have many advantages and have been implemented on many vehicles today, some problems have arisen. For example, repairing flex circuit in the field is not an easy process especially when polyester based materials are involved. Special care needs to be taken by the field technician to make a repair to a flexible circuit, such as those having polyester substrates to ensure the integrity of the flexible circuit.
Therefore there is a need for a new and improved system and method for repairing flexible circuits. The new and improved system and method should prevent the degradation of the substrate of the flexible circuit. Further, the new and improved system and method should provide new solder interconnects that are reliable and sustain the integrity of the flex circuit.
BRIEF SUMMARY OF THE INVENTION
In an aspect of the present invention a new system and method for repairing flexible circuits is provided. The flexible circuits conduct electrical signals to and from electronic devices. Furthermore, the system includes a flexible circuit substrate, at least one electrical conductor, and a repair patch. The flexible circuit substrate has a cut zone and a repair zone. The at least one electrical conductor is supported by the flexible circuit substrate. The electrical conductors are configured to carry electrical signals. The repair patch is used to electrically interconnect at least two repair zones.
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IBM Technical Disclosure Bulletin NN9504479 (Apr. 1, 1995).*
IBM Technical Disclosure Bulletin NA9008213 (Aug. 1, 1990).*
English Abstract of German Pat. No. 100 20 761 A1.
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Baker Jay D.
Belke Robert Edward
Foster Raymond Eric
Fuks Stephen Edward
Schweitzer Charles Frederick
Stoner Kiley
Visteon Global Technologies Inc.
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