System and method for reducing or eliminating semiconductor...

Details System and method for reducing or eliminating semiconductor... System and method for reducing or eliminating semiconductor...

2005-10-18

2005-10-18

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

Reexamination Certificate

active

06955949

ABSTRACT:
A method of packaging a semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors providing interconnection between elements in the semiconductor device. The method also includes encapsulating the conductors and elements, thereby packaging the semiconductor device.

REFERENCES:
patent: 4523371 (1985-06-01), Wakashima
patent: 4788583 (1988-11-01), Kawahara et al.
patent: 4974057 (1990-11-01), Tazima
patent: 5097317 (1992-03-01), Fujimoto et al.
patent: 5206794 (1993-04-01), Long
patent: 5310702 (1994-05-01), Yoshida et al.
patent: 5331205 (1994-07-01), Primeaux
patent: 5434105 (1995-07-01), Liou
patent: 5736792 (1998-04-01), Orcutt
patent: 5818105 (1998-10-01), Kouda
patent: 5824568 (1998-10-01), Zechman
patent: 6177726 (2001-01-01), Manteghi
patent: 6215182 (2001-04-01), Ozawa et al.
patent: 6297078 (2001-10-01), Barrow
patent: 6340846 (2002-01-01), LoBianco et al.
patent: 6344401 (2002-02-01), Lam
patent: 6368899 (2002-04-01), Featherby et al.
patent: 6395807 (2002-05-01), Kinose et al.
patent: 2003/0027918 (2003-02-01), Tsutsumi et al.
patent: 2003/0090001 (2003-05-01), Beatson et al.
patent: 0601323 (1994-06-01), None
patent: 2279944 (1995-01-01), None
patent: 03229433 (1991-10-01), None
patent: 09-129663 (1997-05-01), None
patent: 11087424 (1999-03-01), None
patent: 2001068802 (2001-03-01), None
PCT International Search Report for PCT/US2004/018000, dated Jan. 17, 2005.
International Search Report for PCT International Application No. PCT/US2004/017981, mailed Oct. 13, 2004.

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