Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-10-11
2005-10-11
Zarneke, David A. (Department: 2827)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S760000, C257S774000
Reexamination Certificate
active
06954362
ABSTRACT:
A system and method for reducing an apparent height of a board system are provided. The board system may include, for example, a carrier, a component, a printed circuit board and/or a solder material. The component is mounted on a first side of the carrier. The printed circuit board has a hole that is structured to accommodate the component. The solder material solders the carrier to the printed circuit board and provides a structural bond between the carrier and the printed circuit board. At least one portion of the solder material provides an electrical coupling between the carrier and the printed circuit board and at least one portion of the component is maintained in the hole after the carrier is soldered to the printed circuit board.
REFERENCES:
patent: 5474957 (1995-12-01), Urushima
patent: 5578525 (1996-11-01), Mizukoshi
patent: 5578796 (1996-11-01), Bhatt et al.
patent: 5639695 (1997-06-01), Jones et al.
patent: 5696666 (1997-12-01), Miles et al.
patent: 6037656 (2000-03-01), Sugahara
Dinh Tuan
Kyocera Wireless Corp.
Zarneke David A.
LandOfFree
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