Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-07-18
1997-09-16
Sparks, Donald
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174 51, 228215, 361752, 361818, H05K 504, H05K 900
Patent
active
056686994
ABSTRACT:
There is disclosed a technique for constructing a printed circuit board assembly to provide solder joints with a uniform height. A solder mask is provided on the external surfaces of the printed circuit board to minimize the mount of conductive pad area that is exposed to solder. The solder mask includes a plurality of relatively small openings with a predetermined pattern to minimize the build up of solder, while insuring sufficient solder height to connect to the grounding component located on the chassis to insure adequate EMI protection. Preferably a polka dot pattern is used for certain conductive pads, while a single narrow strip or the solder mask opening configuration is used for rectangular pad configurations. Other configurations and patterns are also available to provide an adequate electrical connection while insuring uniform solder height.
REFERENCES:
patent: 4851614 (1989-07-01), Duncan, Jr.
patent: 5138529 (1992-08-01), Colton et al.
patent: 5326937 (1994-07-01), Watanabe
patent: 5398156 (1995-03-01), Steffes et al.
patent: 5420378 (1995-05-01), Estes et al.
Bell James S.
Khadem Gita
Vivio Joseph A.
Dell USA L.P.
Garrana Henry N.
Kahler Mark P.
Roberts Diana L.
Sparks Donald
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