System and method for providing scalability in an integrated...

Details System and method for providing scalability in an integrated... System and method for providing scalability in an integrated...

2006-05-02

2006-05-02

Nguyen, Cuong (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Gate arrays

With particular chip input/output means

C257S202000, C257S678000, C257S737000

Reexamination Certificate

active

07038257

ABSTRACT:
The invention provides a system and method for providing scalability in an integrated circuit (IC) having a package coupled to a die through package balls. The die includes a plurality of input/output (I/O) slots and a hardmac configured to implement a logic function. A patch board is included between the hardmac and the I/O slots, wherein the hardmac includes a plurality of attachment points. The hardmac is attached to the plurality of I/O slots through the patch board, wherein adjacent attachment points join to non-adjacent I/O slots through the patch board.

REFERENCES:
patent: 5543640 (1996-08-01), Sutherland et al.

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