System and method for providing cooling in a...

Details System and method for providing cooling in a... System and method for providing cooling in a...

2007-07-10

2007-07-10

Duong, Hung Van (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C333S02400C, C340S539260, C029S854000

Reexamination Certificate

active

10754971

ABSTRACT:
A three-dimensional computer infrastructure cooling system is provided. The three-dimensional computer infrastructure cooling system includes at least one compute, storage, or communications brick. In addition, the three-dimensional computer infrastructure cooling system includes at least one coldrail to facilitate the removal of heat from the at least one compute, storage, or communications brick. Also, the three-dimensional computer infrastructure includes a brick-internal carrier within the at least one compute, storage, communications brick, wherein the brick-internal carrier is attached to the at least one coldrail. Moreover, the three-dimensional computer infrastructure includes a power dissipating electronic element within the at-least-one compute, storage, or communications brick, wherein the power dissipating element is attached to the brick-internal carrier.

REFERENCES:
patent: 6137675 (2000-10-01), Perkins
patent: 7005982 (2006-02-01), Frank
patent: 7038553 (2006-05-01), Garner et al.
patent: 7173820 (2007-02-01), Fink et al.

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