System and method for providing a power bus in a wirebond...

Details System and method for providing a power bus in a wirebond... System and method for providing a power bus in a wirebond...

2006-04-27

2009-02-24

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S672000, C257S676000, C257SE23031, C257SE23033, C257SE23042

Reexamination Certificate

active

07495320

ABSTRACT:
An integrated circuit (IC) package, such as a Quad Flat Pack (QFP), has at least one lead with a tip that extends substantially perpendicular to the ends of two or more bondwires, so that there is room for more than one bondwire to be attached to it along its length. Thus, bondwires leading from die bondpads that are not adjacent to one another can be efficiently connected to the same lead in a bus-like manner.

REFERENCES:
patent: 5428247 (1995-06-01), Sohn et al.

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