System and method for predicting burn-in conditions

Details System and method for predicting burn-in conditions System and method for predicting burn-in conditions

2005-11-22

2005-11-22

Bui, Bryan (Department: 2863)

Data processing: measuring, calibrating, or testing

Measurement system

Temperature measuring system

C438S014000

Reexamination Certificate

active

06968287

ABSTRACT:
According to one embodiment of the invention, a method for predicting burn-in conditions includes identifying a baseline IDDQ, a baseline temperature, and a baseline IDDQ current density based on a plurality of existing burn-in data for one or more existing devices, determining a theoretical IDDQ current density for a device, determining a ratio of the theoretical IDDQ current density to the baseline IDDQ current density, determining a theoretical process metric for the device at the baseline temperature based on the ratio and the baseline IDDQ, measuring a process metric for an actual device, comparing the process metric for the actual device and the theoretical process metric for the device, and determining an actual burn-in temperature for the actual device based on the comparison.

REFERENCES:
patent: 6175812 (2001-01-01), Boyington et al.
patent: 6215324 (2001-04-01), Yoshida
patent: 6326800 (2001-12-01), Kirihata
patent: 6377897 (2002-04-01), Boyington et al.
Vollertsen, P;“BURN-IN”; IEEE International Integrated Reliability Workshop Final Report; Oct. 18-21, 1999; pp 167-173.
P. Tadayon, “Thermal Challenges During Microprocessing Testing,” Intel Technology Journal, Q3, 2000, (8 pages).

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