Metal working – Means to assemble or disassemble – Means to assemble electrical device
Reexamination Certificate
2007-07-10
2007-07-10
Olsen, Allan (Department: 1763)
Metal working
Means to assemble or disassemble
Means to assemble electrical device
Reexamination Certificate
active
09884205
ABSTRACT:
A system and method are disclosed which enable post-fabrication reduction of minimum feature size spacing of microcomponents. A method for producing an assembly of microcomponents is provided, in which at least two microcomponents are fabricated having a separation space therebetween. At least one of the microcomponents includes an extension part that is operable to reduce the separation space. Such an extension part may include an extension member that is movably extendable away from its associated microcomponent to reduce the separation space between its associated microcomponent and another microcomponent. The extension part may be latched at a desired position by a latching mechanism. The extension part may be implemented such that the extension member eliminates the separation space, thereby resulting in such extension member engaging another microcomponent. Such engagement may be achieved without requiring power to be applied to the microcomponents. Certain embodiments are insensitive to etching inaccuracy encountered during fabrication.
REFERENCES:
patent: 3439416 (1969-04-01), Yando
patent: 4740410 (1988-04-01), Muller et al.
patent: 5645684 (1997-07-01), Keller
patent: 5660580 (1997-08-01), Keller
patent: 5806152 (1998-09-01), Saitou
patent: 5818748 (1998-10-01), Bertin
patent: 6175170 (2001-01-01), Kota et al.
patent: 6392144 (2002-05-01), Filter et al.
patent: 6561725 (2003-05-01), Ellis et al.
patent: 6872535 (2005-03-01), Baum
patent: 2003/0019838 (2003-01-01), Shaw et al.
patent: 2004/0084319 (2004-05-01), Cohen
U.S. Appl. No. 09/569,328, Ellis et al.
U.S. Appl. No. 09/569,329, Parker et al.
U.S. Appl. No. 09/569,330, Merkle et al.
U.S. Appl. No. 09/570,170, Ellis et al.
U.S. Appl. No. 09/616,500, Ellis et al.
U.S. Appl. No. 09/643,011, Ellis et al.
Thermal Microactuators for Surface Micromachining Processes, Proceedings of the SPIE, V 2642, p. 10-21, 1995.
A New Pick Up & Release Method by Heating for Micromanipulation, by Fumihito Arai and Toshio Fukuda, Jan. 1997.
Avanced Parts Orientation System Has Wide Application, by H. Hitakawa, Aug. 1988.
Design, Fabrication, and Characterization of Single Crystal Silicon Latching Snap Fasteners for Micro Assembly, by Rama Prasad et al., Nov. 1995.
Fluidic Self-Assembly of Microstructures and its Application to the Integration of GaAs on Si, by Hsi-Jen J. Yeh and John S. Smith, Jan. 1994.
Hexsil Tweezers for Teleoperated Microassembly, by C. G. Keller and R. T. Howe, Jan. 1997.
Microassembly Technologies for MEMS, by Michael B. Cohn et al.
Microfabricated High Aspect Ratio Silicon Flexures, by Chris Keller, 1998.
Self-Assembling Electrical Networks: An Application of Micromachining Technology, by Michael B. Cohn et al., May 1991.
Surface-Micromachined Components for Articulated Microrobots, by Richard Yeh, et al., Mar. 1996.
Survey of Sticking Effects for Micro Parts Handling, by Ronald S. Fearing, Apr. 1995.
Ellis Matthew D.
Parker Eric G.
Skidmore George D.
Haynes and Boone LLP
Olsen Allan
Zyvex Labs, LLC
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