System and method for planarizing a substrate surface having...

Abrading – Precision device or process - or with condition responsive... – Computer controlled

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S942000

Reexamination Certificate

active

06949008

ABSTRACT:
A method for planarizing a substrate surface having a non-planar surface topography comprises forming a material layer over the substrate, the material layer having a surface topography, determining the surface topography of the material layer, and forming a mask using information relating to the surface topography of the material layer. The mask defines portions of averaging regions of the material layer for selective removal to equalize the averaging regions in average height, the averaging regions having a maximum dimension. The material layer is etched using the mask, and a planarizing layer is formed over the substrate surface. The planarizing layer provides a low-pass lateral filtering effect characterized by a length greater than the maximum dimension of the averaging region. The mask is created by determining the localized height of the material layer across a surface and using the mask to etch away corresponding portions of the material layer so that the average surface of the material layer approximates a planar surface. The surface of the second material layer is substantially planar. The system and method for planarizing a material layer provides for forming a substantially planar layer of material over a non-planar topography.

REFERENCES:
patent: 6245635 (2001-06-01), Lee
patent: 6381300 (2002-04-01), Ezaki
patent: 6848970 (2005-02-01), Manens et al.
patent: 2002/0164839 (2002-11-01), Enquist

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

System and method for planarizing a substrate surface having... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method for planarizing a substrate surface having..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for planarizing a substrate surface having... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3437881

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.