Handling: hand and hoist-line implements – Utilizing fluid pressure – Venturi effect
Reexamination Certificate
2005-12-13
2005-12-13
Kramer, Dean J. (Department: 3652)
Handling: hand and hoist-line implements
Utilizing fluid pressure
Venturi effect
C294S907000, C294S087100, C029S743000, C901S040000, C901S047000
Reexamination Certificate
active
06974168
ABSTRACT:
Embodiments of the present invention overcome the disadvantages of the metal bond head systems while also providing a method for performing precision die bond of multiple die at once. A mounting system is adapted for simultaneous high accuracy placement of multiple semiconductor components or dies on substrates. Simultaneous high accuracy multiple die placement is achieved by providing a mounting head assembly, including a see-through (ST) bond head with selectively and independently controlled gripping mechanisms, with moving and/or adjusting mechanisms adapted for accurate alignment of semiconductor components relative to a substrate in all directions.
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Intel Corporation
Kramer Dean J.
Pillsbury Winthrop Shaw & Pittman LLP
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