System and method for performing post-plating morphological...

Details System and method for performing post-plating morphological... System and method for performing post-plating morphological...

2006-01-31

2010-11-30

Couso, Yon (Department: 2624)

Image analysis

Applications

Manufacturing or product inspection

C382S110000, C382S266000

Reexamination Certificate

active

07844101

ABSTRACT:
Grain size variations within a copper film are quantified by analyzing an SEM image of a portion of the copper film, determining an approximate total length of grain boundaries within the SEM image, and calculating a grain boundary density based on the approximate total length of the grain boundaries and the area of the copper film represented in the SEM image. The calculated grain boundary density allows for correlating plating and anneal process parameters, as well as electrical and reliability performance.

REFERENCES:
patent: 5376409 (1994-12-01), Kaloyeros et al.
patent: 6339020 (2002-01-01), Weihs et al.
patent: 6458694 (2002-10-01), Ogure et al.
patent: 2002/0037641 (2002-03-01), Ritzdorf et al.
Svidenko et al., “Powerful Quantitative Monitoring Tool Improves CU and W Plug Fill”, Nanochip Technology Journal, Issue Two, 2004, pp. 5-11.

Affiliated with

Also associated with

Rating

System and method for performing post-plating morphological... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method for performing post-plating morphological..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for performing post-plating morphological... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4218628