System and method for passing particles on selected areas on...

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

Reexamination Certificate

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C250S491100

Reexamination Certificate

active

07071478

ABSTRACT:
A method and system is disclosed for directing charged particles on predetermined areas on a target semiconductor substrate. After aligning a wafer mask with a semiconductor wafer, with the wafer mask having one or more mask patterns thereon, the charged particles are directed to pass through the mask patterns to land on one or more selected areas on the semiconductor wafer.

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patent: 6046109 (2000-04-01), Liao et al.
patent: 6214750 (2001-04-01), Liao
patent: 6323500 (2001-11-01), Yamashita
patent: 6362489 (2002-03-01), Okino
patent: 6563125 (2003-05-01), Suzuki
patent: 6624429 (2003-09-01), Wolfe et al.
patent: 6852988 (2005-02-01), Li
patent: 2005/0077485 (2005-04-01), Wang et al.

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