Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2006-08-29
2006-08-29
Owens, Douglas W. (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S680000, C438S106000, C438S121000
Reexamination Certificate
active
07098529
ABSTRACT:
A package optimized for thinning of an attached semiconductor die. The package comprises an extension ring attached to a bottom surface of the package, and a die carrier plate attached to the extension ring for receiving a semiconductor die. The die carrier plate may be attached to the extension ring by an adhesive that permits removal of the carrier plate from the semiconductor die and extension ring by a small applied force after encapsulation of the semiconductor die. The encapsulant may include a filler material for modifying properties such as hardness, thermal coefficient of expansion, thermal conductivity. The materials used for the extension ring and encapsulant may be selected for compatibility with the die lapping operation.
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Siva Kolachina, Kendall Scott Wills, Tim Nagel, Aswin Mehta, Rand Carawan, Omar Diaz de Leon, James Grund, Charles Todd, Kartik Ramanujachar, Sundari Nagarathnam—Texas Instruments, Stafford, USA. Christine Charpentier, Daniel Gobled—Texas Instruments, Nice, France. Willmar Subido—Texas Instruments, Dallas, USA. “Optical Waveform Probing—Strategies for Non-Flipchip Devices and Other Applications”.
Credence Systems Corporation
Owens Douglas W.
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