Chucks or sockets – Vacuum
Reexamination Certificate
2004-09-28
2008-07-08
Carter, Monica S. (Department: 3722)
Chucks or sockets
Vacuum
C269S021000, C118S500000, C451S388000
Reexamination Certificate
active
07396022
ABSTRACT:
The present invention is a chuck having a vacuum groove that is capable of holding a wafer as the chuck rotates on a spindle. As the chuck rotates the air pressure above the center of the wafer is reduced. In order to reduce the bowing of the wafer that can result from this low pressure area above the wafer, the present invention introduces venturi holes in the chuck which reduces the air pressure in the area below the wafer. In order to prevent the air pressure in the area below the wafer from decreasing too far, the present invention uses air inlet holes to balance the affect of the venturi holes in order to substantially balance the air pressure above and below the wafer which results in significantly less bowing of the wafer when compared to conventional systems. The present invention accomplishes this without requiring sensors or other active measuring devices to help reduce the bowing of the wafer.
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Moghadam Alireza Shahdoost
Velidandla Vamsi Mohan
Carter Monica S.
Caven & Aghevli LLC
KLA-Tencor Technologies Corp.
Talbot Michael W
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