System and method for online end point detection for use in...

Data processing: measuring – calibrating – or testing – Measurement system – Statistical measurement

Reexamination Certificate

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C702S030000

Reexamination Certificate

active

07406396

ABSTRACT:
The present invention is an online methodology for end point detection for use in a chemical mechanical planarization process which is both robust and inexpensive while overcoming some of the drawbacks of the existing end point detection approaches currently known in the art. The present invention provides a system and method for identifying a significant event in a chemical mechanical planarization process including the steps of decomposing coefficient of friction data acquired from a chemical mechanical planarization process using wavelet-based multiresolution analysis, and applying a sequential probability ratio test for variance on the decomposed data to identify a significant event in the chemical mechanical planarization process.

REFERENCES:
patent: 6397679 (2002-06-01), Sadok et al.
patent: 6431953 (2002-08-01), Carter et al.
patent: 2005/0223805 (2005-10-01), Ganesan et al.
Tapas K. Das et al., Online End Point Detection in CMP Using SPRT of Wavelet Decomposed Sensor Data, IEEE Transactions of Semiconductor Manufacturing, vol. 18, No. 3, Aug. 2005.

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