System and method for on-machine 3-D depth measurement

Details System and method for on-machine 3-D depth measurement System and method for on-machine 3-D depth measurement

2011-04-19

2011-04-19

Nguyen, Tu T (Department: 2886)

Optics: measuring and testing

Dimension

Cavities

Reexamination Certificate

active

07929155

ABSTRACT:
The present invention provides a method and system for on-machine 3-D depth measurement. The same image retrieving apparatus measures the first distance for the width of the similar gray-level region of cutting-surface from the first angle, and measures the second distance for the width of the similar gray-level region of cutting-surface from the first angle superimposing the second angle. The width of the similar gray-level region of cutting-surface comprises the cutting-surface and the shadow of the bottom portion of the cutting-surface. And then the cutting-surface depth is calculated according to the first angle, the second angle, the first distance, and the second distance.

REFERENCES:
patent: 6039518 (2000-03-01), Day
patent: 7684057 (2010-03-01), Sakai

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