Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate
2005-09-27
2005-09-27
Wilson, Lee D. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Computer controlled
C451S008000, C451S009000, C451S041000, C438S633000, C438S645000, C438S672000, C700S108000, C257S509000, C257S524000
Reexamination Certificate
active
06949007
ABSTRACT:
A fabricating system. A processing tool executes a film removal process on a wafer using a chemical mechanism. A metrology tool monitors surface characteristics of the wafer to obtain a measured film thickness thereof before and after a first removal process, wherein the first removal process lasts a first processing duration. The controller, coupled to the processing and metrology tools, determines whether the difference between the measured film thickness and a preset film thickness exceeds a preset value, and determines a second processing duration of a second removal process according to the measured and preset film thickness and the first processing duration.
REFERENCES:
patent: 6258711 (2001-07-01), Laursen
patent: 6468131 (2002-10-01), Korovin
patent: 6552408 (2003-04-01), Robinson et al.
patent: 6671570 (2003-12-01), Schulze
patent: 6696367 (2004-02-01), Aggarwal et al.
Chen Chii-Ping
Wang Kuo-Hwa
Ojini Anthony
Taiwan Semiconductor Manufacturing Co. Ltd.
Thomas Kayden Horstemeyer & Risley
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