System and method for mounting electronic components onto...

Details System and method for mounting electronic components onto... System and method for mounting electronic components onto...

2007-01-02

2007-01-02

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

With means to cool work or product

C228S200000, C228S222000

Reexamination Certificate

active

10149031

ABSTRACT:
A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).

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